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OSK02MA102A,B Ultra-high precision grinder

Ultra-high precision grinder
Application
      The device for infeed grinding of wafer up to 300mm
Features
    1. Vertical type down feeder type
    2. Easy-to use design with high durability
Effect
    OSK02MA102A
    1. Sensitive feed with 1μm cut is possible
    2. Can be effectively applied to different Si, Sic, etc. processing
    OSK02MA102B
         
     
      Compact design, high-throughput and high cost performance
Specification
     
    Model OSK02MA102A OSK02MA102B
    Type Manual infider grinder Fully automatic back-off grinder
    Correspondent Wf size Chip・00mm Φ3"・00mm
    Grindstone size φ300mm φ250mm
    Chalk plate size φ310mm φ210mm
    Number of chalk plate 1 pc 3 chalk table
    Polishing structure No No
    Foot print
    W x D x H mm
    1100 x 1350 x 2150 1200 x 2750 x 2050
    Corresponding applications Si/Sic/Sapphire Si/SiC/High-precision grinding saphire
OSK02MA102A,B Ultra-high precision grinder

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